• LAST PRICE
    18.3800
  • TODAY'S CHANGE (%)
    Trending Down-0.4300 (-2.2860%)
  • Bid / Lots
    18.3800/ 2
  • Ask / Lots
    18.4100/ 1
  • Open / Previous Close
    18.4800 / 18.8100
  • Day Range
    Low 18.3200
    High 18.5400
  • 52 Week Range
    Low 14.8900
    High 26.6400
  • Volume
    44,407
    below average

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Price Comparison Graph. See accessible table below
1 Day Comparison Chart Accessibility Table. Tuesday's close: 18.81
TimeVolumeAMKR
09:32 ET683918.485
09:34 ET46618.54
09:36 ET198618.53
09:38 ET60018.54
09:39 ET170018.465
09:41 ET40018.39
09:43 ET104818.42
09:45 ET140018.4
09:48 ET316218.48
09:50 ET210018.53
09:52 ET39018.51
09:54 ET30018.48
09:56 ET110018.47
09:57 ET10018.48
09:59 ET140018.49
10:01 ET400618.42
10:03 ET396618.38
10:06 ET80018.37
10:08 ET20018.35
10:10 ET10018.35
10:12 ET70018.38
10:14 ET60018.38
Data delayed at least 15 minutes.
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Industry Peers Overview Table
Company sortableMarket Cap sortableP/E Ratio (TTM) sortableEPS Growth (5yr) sortable
United StatesAMKR
Amkor Technology Inc
4.1B
6.5x
+28.83%
United StatesQRVO
Qorvo Inc
8.4B
11.5x
---
United StatesTER
Teradyne Inc
12.1B
16.8x
---
United StatesUCTT
Ultra Clean Holdings Inc
1.2B
16.3x
+54.76%
United StatesGFS
Globalfoundries Inc
28.5B
54.6x
---
United StatesKLIC
Kulicke and Soffa Industries Inc
2.3B
5.2x
+53.24%
As of 2022-10-05

Company Information

Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip-specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. It refers to its flip chip, wafer-level processing and related test services as Advanced Products, and its wirebond packaging, power device packaging and related test services as Mainstream Products. Its Advanced Products include flip chip scale packages, wafer-level packages, and flip chip ball grid array (FCBGA) packages. Its Mainstream Products include leadframe packages, substrate-based wirebond packages, and micro-electro-mechanical systems (MEMS) packages.

Contact Information

Headquarters
2045 East Innovation CircleTEMPE, AZ, United States 85284
Phone
480-821-5000
Fax
480-821-8276

Executives

Executive Chairman of the Board
James Kim
President, Chief Executive Officer, Director
Giel Rutten
Executive Vice Chairman of the Board
Susan Kim
Chief Financial Officer, Executive Vice President
Megan Faust
Executive Vice President, General Counsel, Corporate Secretary
Mark Rogers

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Fundamentals Table
Market Cap
$4.1B
Revenue (TTM)
$6.5B
Shares Outstanding
244.8M
Dividend Yield
1.09%
Annual Dividend Rate
0.2000 USD
Ex-Dividend Date
09-02-22
Pay Date
09-26-22
Beta
1.55
EPS
$2.82
Book Value
$12.04
P/E Ratio
6.5x
Price/Sales (TTM)
0.6
Price/Cash Flow (TTM)
3.2x
Operating Margin
12.54%
*GAAP = prior to non-GAAP analyst adjusted earnings.

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