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Company | Country | Symbol |
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Time | Volume | BESIY |
---|---|---|
09:32 ET | 165 | 143.32 |
Company sortable | Market Cap sortable | P/E Ratio (TTM) sortable | EPS Growth (5yr) sortable |
---|---|---|---|
BE Semiconductor Industries NV | 12.0B | 62.9x | +5.87% |
Onto Innovation Inc | 8.7B | 72.2x | +0.95% |
FormFactor Inc | 3.3B | 40.3x | -5.30% |
Veeco Instruments Inc | 1.9B | -49.8x | --- |
Kulicke and Soffa Industries Inc | 2.6B | 50.3x | -15.40% |
Cohu Inc | 1.4B | 49.7x | --- |
BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
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Market Cap | $12.0B |
---|---|
Revenue (TTM) | $616.1M |
Shares Outstanding | 81.1M |
Dividend Yield | 1.60% |
Annual Dividend Rate | 2.2861 USD |
Ex-Dividend Date | 04-29-24 |
Pay Date | 05-06-24 |
Beta | 1.74 |
EPS | $2.28 |
Book Value | $5.82 |
P/E Ratio | 62.9x |
Price/Sales (TTM) | 19.5 |
Price/Cash Flow (TTM) | 55.6x |
Operating Margin | 36.86% |
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