BE Semiconductor Industries NV

OTC Pink - Limited Information:BESIYUnited States

BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

Contact Information

Headquarters

Ratio 6DUIVEN, Netherlands 6921 RW

Phone

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Fax

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Executives

Independent Chairman of the Supervisory Board

Richard Norbruis

Chairman of the Management Board, Chief Executive Officer

Richard Blickman

Senior Vice President - Finance

Leon Verweijen

Senior Vice President - Sales Europe/North America

Rene Hendriks

Senior Vice President - Sales and Customer Service APac

Jong Park