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Company | Country | Symbol |
---|
Time | Volume | BESIY |
---|---|---|
09:41 ET | 100 | 134.64 |
10:33 ET | 255 | 133.798 |
10:46 ET | 100 | 134.285 |
11:08 ET | 100 | 134 |
11:22 ET | 109 | 133.18 |
11:56 ET | 136 | 136.63 |
Company sortable | Market Cap sortable | P/E Ratio (TTM) sortable | EPS Growth (5yr) sortable |
---|---|---|---|
BE Semiconductor Industries NV | 10.6B | 62.4x | +5.87% |
Onto Innovation Inc | 9.3B | 67.2x | +0.95% |
FormFactor Inc | 4.0B | 39.3x | -5.30% |
Veeco Instruments Inc | 2.2B | -86.4x | --- |
Kulicke and Soffa Industries Inc | 2.5B | -39.6x | -15.40% |
Cohu Inc | 1.5B | -607.8x | --- |
BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
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Market Cap | $10.6B |
---|---|
Revenue (TTM) | $629.4M |
Shares Outstanding | 81.1M |
Dividend Yield | 1.69% |
Annual Dividend Rate | 2.3048 USD |
Ex-Dividend Date | 04-29-24 |
Pay Date | 05-06-24 |
Beta | 1.78 |
EPS | $2.19 |
Book Value | $5.93 |
P/E Ratio | 62.4x |
Price/Sales (TTM) | 16.9 |
Price/Cash Flow (TTM) | 50.9x |
Operating Margin | 34.25% |
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