• LAST PRICE
    30.5500
  • TODAY'S CHANGE (%)
    Trending Up0.4700 (1.5625%)
  • Bid / Lots
    30.5400/ 1
  • Ask / Lots
    30.5700/ 1
  • Open / Previous Close
    30.0000 / 30.0800
  • Day Range
    Low 30.0000
    High 30.6200
  • 52 Week Range
    Low 20.5800
    High 31.7500
  • Volume
    44,827
    below average

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Price Comparison Graph. See accessible table below
1 Day Comparison Chart Accessibility Table. Monday's close: 30.08
TimeVolumeBHE
09:32 ET76730
09:50 ET240030.295
09:54 ET105130.33
09:56 ET10030.39
09:57 ET10030.35
09:59 ET10030.41
10:01 ET125730.35
10:06 ET70030.33
10:08 ET120030.3
10:10 ET10030.3
10:12 ET30030.34
10:14 ET86930.32
10:15 ET110030.29
10:19 ET10030.29
10:24 ET111830.375
10:26 ET10030.44
10:28 ET110030.4101
10:30 ET98530.458
10:32 ET377930.54
10:33 ET26530.51
10:35 ET123230.5
10:39 ET10030.515
10:48 ET65330.51
10:50 ET104030.53
10:53 ET30030.55
10:55 ET14030.57
10:57 ET36230.595
11:00 ET30030.58
11:02 ET130730.58
11:04 ET20030.51
11:08 ET10030.57
11:09 ET20030.58
11:11 ET35030.559
11:13 ET220030.5854
11:15 ET102230.555
11:18 ET10030.57
11:20 ET30030.57
11:22 ET20030.565
11:24 ET100030.5601
11:26 ET210330.56
11:27 ET30030.55
Data delayed at least 15 minutes.
No documents available
0 New Today
Industry Peers Overview Table
Company sortableMarket Cap sortableP/E Ratio (TTM) sortableEPS Growth (5yr) sortable
United StatesBHE
Benchmark Electronics Inc
1.1B
17.0x
+35.20%
United StatesENR
Energizer Holdings Inc
2.1B
22.3x
-2.10%
United StatesFLNC
Fluence Energy Inc
2.8B
-31.9x
---
United StatesWIRE
Encore Wire Corp
4.5B
13.3x
+42.06%
United StatesSNPO
Snap One Holdings Corp
806.7M
-37.4x
---
United StatesMEI
Methode Electronics Inc
400.3M
-7.2x
-6.76%
As of 2024-04-23

Company Information

Benchmark Electronics, Inc. provides comprehensive solutions across the entire product life cycle through its technology and engineering design services, leveraging its global supply chain and delivering manufacturing services in various industries. The Company provides advanced manufacturing services (electronic manufacturing services (EMS) and precision technology (PT) services), which includes design and engineering services and technology solutions. Its specialization in packaging and interconnect technologies include printed circuit board assembly (PCBA) and test, component engineering services, systems assembly and test, and failure analysis. The Company offers complex PT services, including full electromechanical assembly and test services. Its design and engineering services and technology solutions include new product design, prototype, testing and related engineering services; custom test and automation equipment design and build services, and technology solutions.

Contact Information

Headquarters
56 South Rockford DriveTEMPE, AZ, United States 85281
Phone
623-300-7000
Fax
979-848-5271

Executives

Non-Executive Independent Chairman of the Board
David Scheible
President, Chief Executive Officer, Director
Jeffrey Benck
Interim Chief Financial Officer, Vice President - Finance
Arvind Kamal
Chief Operating Officer, Executive Vice President
Dave Valkanoff
Chief Human Resource Officer, Senior Vice President
Rhonda Turner

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Fundamentals Table
Market Cap
$1.1B
Revenue (TTM)
$2.8B
Shares Outstanding
36.0M
Dividend Yield
2.16%
Annual Dividend Rate
0.6600 USD
Ex-Dividend Date
03-27-24
Pay Date
04-12-24
Beta
1.01
EPS
$1.79
Book Value
$30.26
P/E Ratio
17.0x
Price/Sales (TTM)
0.4
Price/Cash Flow (TTM)
9.9x
Operating Margin
3.86%
*GAAP = prior to non-GAAP analyst adjusted earnings.

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