• LAST PRICE
    19.5800
  • TODAY'S CHANGE (%)
    Trending Up0.1800 (0.9278%)
  • Bid / Lots
    19.0000/ 1
  • Ask / Lots
    19.7300/ 3
  • Open / Previous Close
    19.5000 / 19.4000
  • Day Range
    Low 19.4800
    High 19.6200
  • 52 Week Range
    Low 19.1900
    High 32.1900
  • Volume
    23,556
    below average

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Price Comparison Graph. See accessible table below
1 Day Comparison Chart Accessibility Table. Thursday's close: 19.4
TimeVolumeIMOS
09:32 ET160719.62
10:13 ET152419.52
10:15 ET60019.54
10:20 ET90019.54
10:29 ET70019.5975
10:36 ET20019.53
10:38 ET80019.53
10:40 ET20019.52
10:44 ET50019.55
11:16 ET284519.49
12:08 ET20019.54
12:14 ET22519.5418
12:17 ET17119.54
12:19 ET10019.54
12:51 ET45119.57
12:53 ET190219.53
12:55 ET20019.6063
12:57 ET43319.57
01:15 ET11319.54
01:18 ET41519.5732
01:20 ET20519.5375
01:22 ET62219.53
01:24 ET17019.52
01:40 ET30019.51
01:54 ET15019.555
02:00 ET15019.5385
02:23 ET65519.5335
02:30 ET40019.5627
02:34 ET20019.5
02:36 ET10019.5
02:38 ET41419.54
02:43 ET25519.54
03:03 ET10319.5472
03:06 ET21719.54
03:15 ET69319.52
03:17 ET69719.5266
03:24 ET10019.565
03:44 ET10019.565
03:55 ET27319.5287
04:00 ET60019.58
Data delayed at least 15 minutes.
Industry Peers Overview Table
Company sortableMarket Cap sortableP/E Ratio (TTM) sortableEPS Growth (5yr) sortable
United StatesIMOS
ChipMOS Technologies Inc
719.6M
14.0x
+11.18%
United StatesSTRB
Strasbaugh
10.0
0.0x
---
United StatesTRT
Trio-Tech International
29.2M
51.4x
-9.89%
United StatesATEYY
Advantest Corp
46.8B
66.5x
+3.22%
United StatesAEHR
Aehr Test Systems
360.3M
12.3x
---
United StatesASYS
Amtech Systems Inc
81.8M
-4.1x
---
As of 2024-11-25

Company Information

ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.

Contact Information

Headquarters
No. 1, R&D Road 1, Hsinchu Science ParkBAOSHAN, Taiwan 308
Phone
---
Fax
---

Executives

Chairman of the Board, General Manager
Shih-Jye Cheng
Deputy General Manager-Finance & Accounting Management Center, Corporate Governance Officer, Director
Silvia Su
Senior Deputy General Manager-Strategy & Investor Relations
Jesse Huang
Deputy General Manager - LCDD Production Group
Kuang-Hui Chen
Executive Deputy General Manager-TN Operation Manufacturing Center
Yuan-Feng Hsu

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Fundamentals Table
Market Cap
$719.6M
Revenue (TTM)
$707.0M
Shares Outstanding
36.4M
Dividend Yield
5.61%
Annual Dividend Rate
1.0982 USD
Ex-Dividend Date
06-27-24
Pay Date
07-26-24
Beta
0.87
EPS
$1.40
Book Value
$20.99
P/E Ratio
14.0x
Price/Sales (TTM)
1.0
Price/Cash Flow (TTM)
3.7x
Operating Margin
8.13%
*GAAP = prior to non-GAAP analyst adjusted earnings.

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