ChipMOS Technologies IncNASDAQ:IMOS
- LAST PRICE19.4800
- TODAY'S CHANGE (%)-0.5000 (-2.5025%)
- Bid / Lots---/ ---
- Ask / Lots---/ ---
- Open / Previous Close19.7400 / 19.9800
- Day Range
- 52 Week Range
- Volume19,405
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| Time | Volume | IMOS |
|---|---|---|
| 09:32 ET | 279 | 19.74 |
| 09:44 ET | 500 | 19.69 |
| 09:51 ET | 100 | 19.59 |
| 10:22 ET | 600 | 19.4 |
| 11:00 ET | 1000 | 19.3859 |
| 11:02 ET | 214 | 19.4 |
| 11:12 ET | 100 | 19.37 |
| 12:08 ET | 4437 | 19.31 |
| 12:10 ET | 2000 | 19.3793 |
| 12:26 ET | 668 | 19.37 |
| 12:39 ET | 562 | 19.394 |
| 12:46 ET | 710 | 19.38 |
| 12:55 ET | 100 | 19.415 |
| 01:02 ET | 100 | 19.415 |
| 01:36 ET | 100 | 19.39 |
| 01:54 ET | 100 | 19.4 |
| 02:20 ET | 200 | 19.37 |
| 02:21 ET | 398 | 19.4319 |
| 02:41 ET | 2300 | 19.45 |
| 02:50 ET | 100 | 19.45 |
| 02:54 ET | 300 | 19.435 |
| 02:57 ET | 100 | 19.46 |
| 03:08 ET | 439 | 19.47 |
| 04:00 ET | 338 | 19.48 |
Nov 8, 2024
ChipMOS REPORTS OCTOBER 2024 REVENUE, from 6:00AM ET on Friday Nov 08, 2024 by Dow Jones
6:00AM ET on Friday Nov 08, 2024 by Dow Jones
Nov 5, 2024
ChipMOS REPORTS THIRD QUARTER 2024 RESULTS, from 3:00AM ET on Tuesday Nov 05, 2024 by Dow Jones
3:00AM ET on Tuesday Nov 05, 2024 by Dow JonesPress Release: ChipMOS REPORTS THIRD QUARTER 2024 RESULTS, from 3:00AM ET on Tuesday Nov 05, 2024 by Dow Jones
3:00AM ET on Tuesday Nov 05, 2024 by Dow JonesDJ Table: ChipMOS Technologies 3Q Net Profit NT$299.4M Vs NT$580.6M, from 1:07AM ET on Tuesday Nov 05, 2024 by Dow Jones
1:07AM ET on Tuesday Nov 05, 2024 by Dow Jones
| Company sortable | Market Cap sortable | P/E Ratio (TTM) sortable | EPS Growth (5yr) sortable |
|---|---|---|---|
ChipMOS Technologies Inc | 727.0M | 13.9x | +11.18% |
Strasbaugh | 10.0 | 0.0x | --- |
Trio-Tech International | 29.2M | 51.1x | -9.89% |
Advantest Corp | 45.7B | 58.6x | +3.22% |
Aehr Test Systems | 360.3M | 11.9x | --- |
Amtech Systems Inc | 81.8M | -4.0x | --- |
Company Information
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Contact Information
- Headquarters
- No. 1, R&D Road 1, Hsinchu Science ParkBAOSHAN, Taiwan 308
- Phone
- ---
- Fax
- ---
Executives
- Chairman of the Board, General Manager
- Shih-Jye Cheng
- Deputy General Manager
- Silvia Su
- Senior Deputy General Manager-Strategy & Investor Relations
- Jesse Huang
- Deputy General Manager - LCDD Production Group
- Kuang-Hui Chen
- Executive Deputy General Manager-TN Operation Manufacturing Center
- Yuan-Feng Hsu
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Market Cap | $713.5M |
|---|---|
Revenue (TTM) | $707.2M |
Shares Outstanding | 36.4M |
Dividend Yield | 5.64% |
Annual Dividend Rate | 1.0982 USD |
Ex-Dividend Date | 06-27-24 |
Pay Date | 07-26-24 |
Beta | 0.87 |
EPS | $1.40 |
Book Value | $21.00 |
P/E Ratio | 13.9x |
Price/Sales (TTM) | 1.0 |
Price/Cash Flow (TTM) | 3.6x |
Operating Margin | 8.13% |
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