• LAST PRICE
    5.9000
  • TODAY'S CHANGE (%)
    0.0000 (0.0000%)
  • Bid / Lots
    5.2100/ 5
  • Ask / Lots
    6.2600/ 3
  • Open / Previous Close
    --- / 5.9000
  • Day Range
    ---
  • 52 Week Range
    Low 3.3700
    High 8.1100
  • Volume
    ---
    below average

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Price Comparison Graph. See accessible table below
1 Day Comparison Chart Accessibility Table. Friday's close: 5.75
TimeVolumeASYS
09:32 ET1285.8
09:46 ET1005.87
10:20 ET4265.88
10:27 ET2005.88
10:29 ET1005.88
10:31 ET3385.87
10:40 ET2005.88
10:56 ET5605.88
11:12 ET13005.84
11:16 ET1005.82
11:18 ET1005.84
11:34 ET1005.87
11:59 ET1005.87
12:30 ET32005.795
12:32 ET37255.825
12:57 ET1005.855
01:49 ET2005.872656
02:09 ET3965.88
02:27 ET10005.87
02:32 ET1005.88
02:36 ET24725.91
02:50 ET1505.91
03:24 ET2005.94
03:50 ET1416
03:51 ET2005.98
04:00 ET3055.9
Data delayed at least 15 minutes.
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0 New Today
Industry Peers Overview Table
Company sortableMarket Cap sortableP/E Ratio (TTM) sortableEPS Growth (5yr) sortable
United StatesASYS
Amtech Systems Inc
81.8M
-4.2x
---
United StatesTRT
Trio-Tech International
29.2M
51.2x
-9.89%
United StatesAEHR
Aehr Test Systems
360.3M
12.9x
---
United StatesIMOS
ChipMOS Technologies Inc
727.0M
14.1x
+11.18%
United StatesSTRB
Strasbaugh
10.0
0.0x
---
United StatesATEYY
Advantest Corp
45.7B
64.2x
+3.22%
As of 2024-11-26

Company Information

Amtech Systems, Inc. is a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications. The Company's segments include semiconductor, and material and substrate. The semiconductor segment is engaged in the supply of thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics and electro/mechanical assembly manufacturers. The material and substrate segment is engaged in the production of wafer cleaning equipment as well as substrate consumables and chemicals for lapping (fine abrading) and polishing of materials, such as silicon wafers for semiconductor products, sapphire wafers for light-emitting diode (LED) applications, and compound substrates, like silicon carbide (SiC) wafers, for power device applications.

Contact Information

Headquarters
58 S River Drive Suite 370TEMPE, AZ, United States 85288
Phone
480-967-5146
Fax
480-968-3763

Executives

Chairman of the Board, President, Chief Executive Officer
Robert Daigle
Chief Financial Officer
Wade Jenke
Lead Independent Director
Michael Garnreiter
Independent Director
Robert Averick
Independent Director
Michael Ludwig

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Fundamentals Table
Market Cap
$81.8M
Revenue (TTM)
$104.8M
Shares Outstanding
14.2M
Dividend Yield
0.00%
Annual Dividend Rate
---
Ex-Dividend Date
01-01-01
Pay Date
01-01-01
Beta
1.44
EPS
$-1.41
Book Value
$6.23
P/E Ratio
-4.2x
Price/Sales (TTM)
0.8
Price/Cash Flow (TTM)
---
Operating Margin
-17.60%
*GAAP = prior to non-GAAP analyst adjusted earnings.

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