ChipMOS Technologies Inc

NASDAQ:IMOSUnited States

ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.

Contact Information

Headquarters

No. 1, R&D Road 1, Hsinchu Science ParkBAOSHAN, Taiwan 308

Phone

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Fax

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Executives

Chairman of the Board, General Manager

Shih-Jye Cheng

Deputy General Manager-Finance & Accounting Management Center, Corporate Governance Officer, Director

Silvia Su

Senior Deputy General Manager-Strategy & Investor Relations

Jesse Huang

Deputy General Manager - LCDD Production Group

Kuang-Hui Chen

Executive Deputy General Manager-TN Operation Manufacturing Center

Yuan-Feng Hsu