• LAST PRICE
    192.6000
  • TODAY'S CHANGE (%)
    Trending Down-1.4500 (-0.7472%)
  • Bid / Lots
    192.5800/ 6
  • Ask / Lots
    192.6400/ 1
  • Open / Previous Close
    193.8300 / 194.0500
  • Day Range
    Low 190.5700
    High 194.0000
  • 52 Week Range
    Low 95.2501
    High 212.6000
  • Volume
    3,489,019
    above average

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Price Comparison Graph. See accessible table below
1 Day Comparison Chart Accessibility Table. Monday's close: 194.05
TimeVolumeTSM
09:32 ET366926192.7875
09:33 ET154919191.88
09:35 ET159008191.3106
09:37 ET132426191.88
09:39 ET90137191.52
09:42 ET80844191.69
09:44 ET164882190.905
09:46 ET59232190.93
09:48 ET78653191.11
09:50 ET91400191.485
09:51 ET143316191.8
09:53 ET126631192.185
09:55 ET86558192.08
09:57 ET96822192.775
10:00 ET60689192.965
10:02 ET62634193.13
10:04 ET58272193.02
10:06 ET58773192.37
10:08 ET66478192.3
10:09 ET33138192.59
10:11 ET28996192.495
10:13 ET50625192.785
10:15 ET25961192.675
Data delayed at least 15 minutes.
Industry Peers Overview Table
Company sortableMarket Cap sortableP/E Ratio (TTM) sortableEPS Growth (5yr) sortable
United StatesTSM
Taiwan Semiconductor Manufacturing Co Ltd
872.9B
31.2x
+19.02%
United StatesMPWR
Monolithic Power Systems Inc
31.6B
75.3x
+29.68%
United States
8.9B
---
-0.18%
United StatesENPH
Enphase Energy Inc
8.6B
139.5x
---
United StatesTTMI
TTM Technologies Inc
2.5B
38.2x
---
United StatesCRUS
Cirrus Logic Inc
5.6B
17.9x
+27.38%
As of 2024-11-12

Company Information

Taiwan Semiconductor Manufacturing Co Ltd is a Taiwan-based company mainly engaged in the provision of integrated circuit manufacturing services. The integrated circuit manufacturing services include process technology, special process technology, design ecosystem support, mask technology, 3DFabricTM advanced packaging and silicon stacking technology services. The Company has completed the transfer and mass production of 5nm technology, and is engaged in the research and development of 3nm process technology and 2nm process technology. The product application range covers the entire electronic application industry, including personal computers and peripheral products, information application products, wired and wireless communication system products, servers and data centers.

Contact Information

Headquarters
No.8 Li-Hsin 6th Road, Hsinchu Science ParkHSINCHU, Taiwan 300
Phone
---
Fax
---

Executives

Chairman of the Board, President
C.C. Wei
Chief Financial Officer, Senior Deputy General Manager-Finance
Wendell Huang
Co-Chief Operating Officer, Executive Deputy General Manager
Y.P. Chin
Co-Chief Operating Officer, Executive Deputy General Manager
Y.J. Mii
Chief Information Officer, Deputy General Manager-Information Technology & Materials Management & Risk Management / Corporate Information Technology
Horng-Dar Lin

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Fundamentals Table
Market Cap
$872.9B
Revenue (TTM)
$81.9B
Shares Outstanding
5.2B
Dividend Yield
1.21%
Annual Dividend Rate
2.3269 USD
Ex-Dividend Date
12-12-24
Pay Date
01-09-25
Beta
1.12
EPS
$6.18
Book Value
$20.60
P/E Ratio
31.2x
Price/Sales (TTM)
10.7
Price/Cash Flow (TTM)
16.8x
Operating Margin
43.62%
*GAAP = prior to non-GAAP analyst adjusted earnings.

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