Amkor Technology IncNASDAQ:AMKR
- LAST PRICE26.5400
- TODAY'S CHANGE (%)0.1900 (0.7211%)
- Bid / Lots26.5400/ 1
- Ask / Lots26.5600/ 8
- Open / Previous Close26.2500 / 26.3500
- Day Range
- 52 Week Range
- Volume127,970
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| Time | Volume | AMKR |
|---|---|---|
| 09:32 ET | 7723 | 26.27 |
| 09:33 ET | 400 | 26.285 |
| 09:35 ET | 382 | 26.44 |
| 09:37 ET | 2179 | 26.55 |
| 09:39 ET | 850 | 26.55 |
| 09:42 ET | 800 | 26.5 |
| 09:44 ET | 1350 | 26.475 |
| 09:46 ET | 224 | 26.49 |
| 09:48 ET | 100 | 26.475 |
| 09:50 ET | 2791 | 26.51 |
| 09:51 ET | 2900 | 26.41 |
| 09:53 ET | 3088 | 26.42 |
| 09:55 ET | 200 | 26.49 |
| 09:57 ET | 900 | 26.51 |
| 10:00 ET | 100 | 26.51 |
| 10:02 ET | 1100 | 26.441 |
| 10:04 ET | 1400 | 26.525 |
| 10:06 ET | 1255 | 26.47 |
| 10:08 ET | 400 | 26.47 |
| 10:09 ET | 500 | 26.4 |
| 10:11 ET | 2000 | 26.346567 |
| 10:13 ET | 1300 | 26.3224 |
| 10:15 ET | 700 | 26.32 |
| 10:18 ET | 200 | 26.32 |
| 10:20 ET | 200 | 26.34 |
| 10:22 ET | 306 | 26.38 |
| 10:24 ET | 327 | 26.37 |
| 10:26 ET | 3757 | 26.45 |
| 10:27 ET | 445 | 26.41 |
| 10:29 ET | 900 | 26.365 |
| 10:31 ET | 1730 | 26.39 |
| 10:33 ET | 3362 | 26.39 |
| 10:36 ET | 1277 | 26.405 |
| 10:38 ET | 200 | 26.43 |
| 10:40 ET | 480 | 26.45 |
| 10:42 ET | 612 | 26.465 |
| 10:44 ET | 4622 | 26.49 |
| 10:45 ET | 1609 | 26.485 |
| 10:47 ET | 900 | 26.455 |
| 10:49 ET | 300 | 26.445 |
| 10:51 ET | 500 | 26.46 |
| 10:54 ET | 100 | 26.48 |
| 10:56 ET | 925 | 26.45 |
| 10:58 ET | 1600 | 26.48 |
| 11:00 ET | 1086 | 26.495 |
| 11:02 ET | 1496 | 26.55 |
| 11:03 ET | 900 | 26.52 |
| 11:07 ET | 800 | 26.51 |
| 11:09 ET | 630 | 26.49 |
| 11:12 ET | 1800 | 26.49 |
| 11:14 ET | 1000 | 26.47 |
| 11:16 ET | 900 | 26.45 |
| 11:18 ET | 500 | 26.44 |
| 11:20 ET | 120 | 26.43 |
| 11:21 ET | 408 | 26.365 |
| 11:23 ET | 769 | 26.4 |
| 11:25 ET | 407 | 26.41 |
| 11:27 ET | 575 | 26.4162 |
| 11:30 ET | 3337 | 26.3809 |
| 11:32 ET | 3122 | 26.45 |
| 11:34 ET | 200 | 26.445 |
| 11:36 ET | 1538 | 26.505 |
| 11:38 ET | 1400 | 26.5 |
| 11:39 ET | 2333 | 26.55 |
| 11:41 ET | 497 | 26.55 |
| 11:43 ET | 900 | 26.525 |
| 11:45 ET | 1200 | 26.54 |
| 11:48 ET | 381 | 26.545 |
| 11:50 ET | 1040 | 26.54 |
Nov 19, 2024
Amkor Technology to Present at Upcoming Conferences, from 8:30AM ET on Tuesday Nov 19, 2024 by Dow Jones
8:30AM ET on Tuesday Nov 19, 2024 by Dow Jones
Nov 14, 2024
Lightmatter and Amkor Technology Partner to Build World's Largest 3D Photonics Package, from 12:00PM ET on Thursday Nov 14, 2024 by Dow Jones
12:00PM ET on Thursday Nov 14, 2024 by Dow Jones
Nov 13, 2024
Press Release: Amkor Technology Declares Increase in Quarterly Dividend and Special Dividend, from 1:05PM ET on Wednesday Nov 13, 2024 by Dow Jones
1:05PM ET on Wednesday Nov 13, 2024 by Dow JonesAmkor Technology Declares Increase in Quarterly Dividend and Special Dividend, from 1:05PM ET on Wednesday Nov 13, 2024 by Dow Jones
1:05PM ET on Wednesday Nov 13, 2024 by Dow Jones
Oct 29, 2024
DJ Amkor Technology Is Maintained at Buy by DA Davidson, from 12:59PM ET on Tuesday Oct 29, 2024 by Dow Jones
12:59PM ET on Tuesday Oct 29, 2024 by Dow Jones
| Company sortable | Market Cap sortable | P/E Ratio (TTM) sortable | EPS Growth (5yr) sortable |
|---|---|---|---|
Amkor Technology Inc | 6.5B | 18.0x | +18.50% |
GlobalFoundries Inc | 23.2B | 32.0x | --- |
Entegris Inc | 15.9B | 70.4x | -6.70% |
Teradyne Inc | 17.2B | 34.0x | +5.51% |
Ultra Clean Holdings Inc | 1.7B | 511.5x | --- |
Axcelis Technologies Inc | 2.4B | 11.0x | +39.80% |
Company Information
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Contact Information
- Headquarters
- 2045 East Innovation CircleTEMPE, AZ, United States 85284
- Phone
- 480-821-5000
- Fax
- 480-821-8276
Executives
- Chairman of the Board
- Susan Kim
- Executive Vice President
- Giel Rutten
- Chief Financial Officer, Executive Vice President, Treasurer
- Megan Faust
- Executive Vice President, General Counsel, Corporate Secretary
- Mark Rogers
- Executive Vice President - Business Units
- Kevin Engel
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Market Cap | $6.5B |
|---|---|
Revenue (TTM) | $6.4B |
Shares Outstanding | 246.6M |
Dividend Yield | 1.25% |
Annual Dividend Rate | 0.3308 USD |
Ex-Dividend Date | 12-04-24 |
Pay Date | 12-23-24 |
Beta | 1.86 |
EPS | $1.48 |
Book Value | $16.11 |
P/E Ratio | 18.0x |
Price/Sales (TTM) | 1.0 |
Price/Cash Flow (TTM) | 6.7x |
Operating Margin | 7.18% |
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