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Company | Country | Symbol |
---|
Time | Volume | AMKR |
---|---|---|
09:32 ET | 12601 | 26.9 |
09:33 ET | 3325 | 26.885 |
09:35 ET | 2340 | 27.03 |
09:37 ET | 4619 | 27.02 |
09:39 ET | 400 | 26.95 |
09:42 ET | 1515 | 27.09 |
09:46 ET | 1850 | 27.145 |
09:48 ET | 900 | 27.105 |
09:50 ET | 12123 | 27.09 |
09:51 ET | 326 | 27.0822 |
09:53 ET | 14159 | 27.02 |
09:55 ET | 1300 | 27.0633 |
09:57 ET | 4360 | 27.0278 |
10:00 ET | 1317 | 26.985 |
10:02 ET | 1150 | 26.935 |
10:04 ET | 1701 | 26.7999 |
10:06 ET | 1606 | 26.8657 |
10:08 ET | 882 | 26.92 |
10:09 ET | 564 | 26.91 |
10:11 ET | 1050 | 26.89 |
10:13 ET | 1243 | 26.87 |
10:15 ET | 4395 | 26.91 |
10:18 ET | 2277 | 26.94 |
10:20 ET | 5585 | 26.94 |
10:22 ET | 464 | 26.91 |
10:24 ET | 300 | 26.995 |
10:26 ET | 3062 | 27.08 |
10:27 ET | 1580 | 27.16 |
10:29 ET | 2330 | 27.205 |
10:31 ET | 17058 | 27.32 |
10:33 ET | 2861 | 27.21 |
10:36 ET | 2751 | 27.13 |
10:38 ET | 2878 | 27.13 |
10:40 ET | 12168 | 27.1754 |
10:42 ET | 3156 | 27.18 |
10:44 ET | 7132 | 27.25 |
10:45 ET | 3871 | 27.245 |
10:47 ET | 567 | 27.2 |
10:49 ET | 900 | 27.235 |
10:51 ET | 1531 | 27.26 |
10:54 ET | 2425 | 27.31 |
10:56 ET | 3808 | 27.3348 |
10:58 ET | 3477 | 27.27 |
11:00 ET | 944 | 27.27 |
11:02 ET | 1478 | 27.24 |
11:03 ET | 1650 | 27.31 |
11:05 ET | 685 | 27.27 |
11:07 ET | 1569 | 27.28 |
11:09 ET | 4452 | 27.21 |
11:12 ET | 5070 | 27.16 |
11:14 ET | 1765 | 27.13 |
11:16 ET | 2332 | 27.17 |
11:18 ET | 1261 | 27.19 |
11:20 ET | 1000 | 27.2 |
11:21 ET | 200 | 27.22 |
11:23 ET | 4538 | 27.215 |
11:25 ET | 1300 | 27.14 |
11:27 ET | 1807 | 27.18 |
11:30 ET | 691 | 27.18 |
11:32 ET | 2300 | 27.24 |
11:34 ET | 2152 | 27.24 |
11:36 ET | 3259 | 27.1637 |
11:38 ET | 2108 | 27.12 |
11:39 ET | 2200 | 27.13 |
11:41 ET | 1286 | 27.05 |
11:43 ET | 3884 | 27.0501 |
11:45 ET | 1326 | 27.04 |
11:48 ET | 500 | 27.05 |
11:50 ET | 6411 | 27.025 |
11:52 ET | 3388 | 26.96 |
11:54 ET | 3295 | 27 |
11:56 ET | 1191 | 27 |
11:57 ET | 3413 | 27.05 |
11:59 ET | 873 | 27.07 |
12:01 ET | 3948 | 27.02 |
12:03 ET | 2200 | 27.04 |
12:06 ET | 5400 | 27.095 |
12:08 ET | 4500 | 27.14 |
12:10 ET | 11083 | 27.15 |
12:12 ET | 3300 | 27.18 |
12:14 ET | 3816 | 27.15 |
12:15 ET | 2529 | 27.08 |
12:17 ET | 1455 | 27.08 |
12:19 ET | 2194 | 27.1 |
12:21 ET | 8373 | 27.0901 |
12:24 ET | 998 | 27.03 |
12:26 ET | 4936 | 27.04 |
12:28 ET | 2805 | 27.04 |
12:30 ET | 8549 | 27.0232 |
12:32 ET | 3039 | 27.02 |
12:33 ET | 2581 | 27.02 |
12:35 ET | 1200 | 27.025 |
12:37 ET | 2862 | 26.98 |
12:39 ET | 862 | 26.97 |
12:42 ET | 500 | 26.965 |
12:44 ET | 480 | 26.95 |
12:46 ET | 1876 | 26.9 |
12:48 ET | 3222 | 26.84 |
12:50 ET | 1639 | 26.85 |
12:51 ET | 2503 | 26.91 |
12:53 ET | 1885 | 26.87 |
12:55 ET | 4752 | 26.88 |
12:57 ET | 2400 | 26.83 |
01:00 ET | 1918 | 26.825 |
01:02 ET | 9950 | 26.88 |
01:04 ET | 4778 | 26.91 |
01:06 ET | 1322 | 26.9 |
01:08 ET | 1549 | 26.87 |
01:09 ET | 5950 | 26.92 |
01:11 ET | 300 | 26.89 |
01:13 ET | 1000 | 26.92 |
01:15 ET | 7316 | 26.93 |
01:18 ET | 2200 | 26.97 |
01:20 ET | 3724 | 26.91 |
01:22 ET | 4459 | 26.91 |
01:24 ET | 3007 | 26.94 |
Company sortable | Market Cap sortable | P/E Ratio (TTM) sortable | EPS Growth (5yr) sortable |
---|---|---|---|
Amkor Technology Inc | 6.5B | 18.2x | +18.50% |
GlobalFoundries Inc | 23.7B | 33.8x | --- |
Entegris Inc | 16.2B | 71.9x | -6.70% |
Teradyne Inc | 17.6B | 35.4x | +5.51% |
Ultra Clean Holdings Inc | 1.7B | 525.8x | --- |
Axcelis Technologies Inc | 2.4B | 11.4x | +39.80% |
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
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Market Cap | $6.5B |
---|---|
Revenue (TTM) | $6.4B |
Shares Outstanding | 246.6M |
Dividend Yield | 1.23% |
Annual Dividend Rate | 0.3308 USD |
Ex-Dividend Date | 12-04-24 |
Pay Date | 12-23-24 |
Beta | 1.85 |
EPS | $1.48 |
Book Value | $16.11 |
P/E Ratio | 18.2x |
Price/Sales (TTM) | 1.0 |
Price/Cash Flow (TTM) | 6.7x |
Operating Margin | 7.18% |
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